
Product features:
The paste is uniform, odorless, and not layered;
Good printing performance, strong adhesion, and minimal collapse;
Good wettability, minimal splashing, fewer tin beads, and excellent welding performance;
Full solder joints, few voids, and high insulation resistance between solder joints;
Good conductivity and thermal conductivity.
This product is suitable for SMT surface mount and reflow soldering processes. Specially suitable for special applications with high requirements for conductivity, thermal conductivity, and mechanical properties.

Product features:
The paste is uniform, odorless, and not layered;
Good printing performance, strong adhesion, and minimal collapse;
Good wettability, minimal splashing, fewer tin beads, and excellent welding performance;
Full solder joints, few voids, and high insulation resistance between solder joints;
Excellent conductivity and thermal conductivity.
This product is suitable for SMT surface mount and reflow soldering processes. Specially suitable for special applications with high requirements for conductivity, thermal conductivity, and mechanical properties.

Product features:
The paste is uniform, odorless, and not layered;
Good printing performance, strong adhesion, and minimal collapse;
Good wettability, minimal splashing, fewer tin beads, and excellent welding performance;
Full solder joints, few voids, and high insulation resistance between solder joints;
Melting point 139 ℃.
This product is suitable for SMT surface mount and reflow soldering processes. Specially suitable for special soldering applications of thermal sensitive components.

Product features:
The paste is uniform, odorless, and not layered;
Good printing performance, strong adhesion, and minimal collapse;
Good wettability, minimal splashing, fewer tin beads, and excellent welding performance;
Full solder joints, few voids, and high insulation resistance between solder joints;
This product is suitable for SMT surface mount and reflow soldering processes.