FY-206 No-clean Flux
Catalogue：Soldering Flux
Product features:
Low solid content;
Good wetting performance;
Less residue after welding;
The solder joints are reliable, clean, and aesthetically pleasing.
This product is suitable for high reliability electronic product PCB assembly using wave soldering and hot-dip soldering without cleaning processes.
Information
This product is developed using a high-tech multi-component formula and is a high-performance, multi-purpose, no cleaning flux. If the solid content is less than 2.5%, the PCB board can meet the SJ/T11389-2019 electronic industry standard without cleaning after soldering.
Product features:
Low solid content;
Good wetting performance;
Less residue after welding;
The solder joints are reliable, clean, and aesthetically pleasing.
This product is suitable for high reliability electronic product PCB assembly using wave soldering and hot-dip soldering without cleaning processes.
Model: FY-206 Cleaning Free Flux
Packaging specifications: 500mL/bottle (20 bottles/box), 1L/bottle (20 bottles/box), 5L/barrel (6 barrels/box), 20L/barrel
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FY-N99 No-clean Flux
Product features:
Very low solid content;
Good wetting performance;
There is very little residue after welding;
The solder joints are reliable, clean, and aesthetically pleasing.
This product is suitable for high reliability electronic product PCB assembly using wave soldering and hot-dip soldering without cleaning processes.
FY-9901 Rosin Flux
Product features:
Good wetting performance and high soldering efficiency;
Beautiful and reliable solder joints;
Low ion pollution level.
This product is suitable for tinning electronic component leads, immersion soldering, mobile soldering, and manual soldering of printed boards, especially for immersion soldering processes of self melting enameled wires.
