FY-N99 No-clean Flux
Catalogue：Soldering Flux
Product features:
Very low solid content;
Good wetting performance;
There is very little residue after welding;
The solder joints are reliable, clean, and aesthetically pleasing.
This product is suitable for high reliability electronic product PCB assembly using wave soldering and hot-dip soldering without cleaning processes.
Information
This product is developed using a high-tech multi-component formula and is a high-performance, multi-purpose, and environmentally friendly no cleaning flux. If the solid content is less than 2.0%, the PCB board can meet the SJ/T11389-2019 electronic industry standard without cleaning after soldering. The product complies with and exceeds the requirements of the EU RoHS directive.
Product features:
Very low solid content;
Good wetting performance;
There is very little residue after welding;
The solder joints are reliable, clean, and aesthetically pleasing.
This product is suitable for high reliability electronic product PCB assembly using wave soldering and hot-dip soldering without cleaning processes.
Model: FY-N99 Cleaning Free Flux
Packaging specifications: 500mL/bottle (20 bottles/box), 1L/bottle (20 bottles/box), 5L/barrel (6 barrels/box), 20L/barrel
- Related products
FY-206 No-clean Flux
Product features:
Low solid content;
Good wetting performance;
Less residue after welding;
The solder joints are reliable, clean, and aesthetically pleasing.
This product is suitable for high reliability electronic product PCB assembly using wave soldering and hot-dip soldering without cleaning processes.
