Silver Containing Solder Bar

Silver Containing Solder Bar

Catalogue:Tin Lead Solder Bar

Product features:

  • Good fluidity;  

  • The amount of slag produced is extremely small;  

  • Full and reliable solder joints;

  • Excellent conductivity and thermal conductivity.  

This product is suitable for wave soldering and hot-dip soldering of electronics, instruments, household appliances, and printed circuit boards (PCBs). Specially suitable for special applications such as silver electrode conductors, photovoltaic solder strips, etc. that require high conductivity, thermal conductivity, and mechanical properties.

Information

This product uses high-purity refined tin and silver as the main raw materials, combined with advanced melting technology, and specially added with a unique anti-oxidation alloy that has been developed for many years. At the brazing working temperature, the liquid brazing material has a smooth surface and very little slag discharge.

Product features:

  • Good fluidity;

  • The amount of slag produced is extremely small;

  • Full and reliable solder joints;

  • Excellent conductivity and thermal conductivity.

This product is suitable for wave soldering and hot-dip soldering of electronics, instruments, household appliances, and printed circuit boards (PCBs). Specially suitable for special applications such as silver electrode conductors, photovoltaic solder strips, etc. that require high conductivity, thermal conductivity, and mechanical properties.

Model: Silver containing solder bar

Packaging specification: 500g per piece (25kg per box)

Instructions:

Suggested working temperature: 330-380 ℃, which can be adjusted appropriately depending on the welding condition and welding effect.

Suggest using our company's matching soldering flux for better performance.

After spraying flux on the welded parts, please preheat and dry them thoroughly.

Maintaining a full liquid level in the tin furnace can effectively reduce the generation of tin slag.

To prevent foreign objects from entering the tin solution, utensils that come into contact with the tin solution should avoid using materials such as zinc, aluminum, copper, etc.

Mixing different solder bars should be avoided.

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Hangzhou Youbang Solder Materials Co., Ltd
Address:No. 209 Chongxian Road,Gaohong Town, Lin an District, Hangzhou City, Zhejiang Province, China
Tel:0571-88755666
Fax:0571-88751508
https://www.cnyoubang.com/en