
Product features:
Good fluidity;
The amount of slag produced is extremely small;
The solder joints are full, shiny, and reliable.
This product is suitable for wave soldering and hot-dip soldering processes in electronics, instruments, household appliances, printed circuit boards, etc. Cooperating with AIA's environmentally friendly soldering flux yields better results.
This product uses high-purity refined tin as the main raw material, adopts advanced melting technology, and specially adds a unique anti-oxidation alloy that has been developed for many years. When the brazing working temperature is less than 300 ℃, the surface of the liquid brazing material is as bright as a mirror.
Product features:
Good fluidity;
The amount of slag produced is extremely small;
The solder joints are full, shiny, and reliable.
This product is suitable for wave soldering and hot-dip soldering processes in electronics, instruments, household appliances, printed circuit boards, etc. Cooperating with AIA's environmentally friendly soldering flux yields better results.
| MODEL | ALLOY COMPOSITION | MELTING POINT |
| Sn63PbA | tin63%、lead37% | 183℃ |
| Sn60PbA | tin60%、lead40% | 183~190℃ |
| Sn55PbA | tin55%、lead45% | 183~203℃ |
| Sn50PbA | tin50%、lead50% | 183~215℃ |
| Sn45PbA | tin45%、lead55% | 183~221℃ |
| Sn40PbA | tin40%、lead60% | 183~238℃ |
| Sn35PbA | tin35%、lead65% | 183~248℃ |
| Sn30PbA | tin30%、lead70% | 183~258℃ |
| Sn25PbA | tin25%、lead75% | 183~267℃ |
| Sn20PbA | tin20%、lead80% | 183~279℃ |
| Sn20Pb78.5Ag1.5 | tin20%、lead78.5%、silver1.5% | 183~270℃ |
Packaging specification: 500g per piece (25kg per box)
instructions:
Suggested working temperature: 245-255 ℃, which can be adjusted appropriately depending on the welding condition and welding effect.
Suggest using our company's matching soldering flux for better performance.
After spraying flux on the welded parts, please preheat and dry them thoroughly.
Maintaining a full liquid level in the tin furnace can effectively reduce the generation of tin slag.
To prevent foreign objects from entering the tin solution, utensils that come into contact with the tin solution should avoid using materials such as zinc, aluminum, copper, etc.
Mixing different solder bars should be avoided.

Product features:
High melting point and good high-temperature strength;
Good fluidity;
Less slag output;
The solder joints are full and reliable.
This product is suitable for high-temperature tinning of self melting enameled wire for various transformer manufacturing. Cooperating with AIA's environmentally friendly soldering flux yields better results.