
Product features:
High melting point (melting point: 227-309 ℃), good high-temperature strength;
Good fluidity;
Less slag output;
The solder joints are full and reliable.
This product is suitable for high-temperature tinning of self melting enameled wire for various transformer manufacturing.
This product uses high-purity refined tin as the main raw material, combined with advanced melting technology, and specially adds a unique anti-oxidation alloy that has been developed for many years. This product complies with and exceeds the requirements of the EU RoHS directive.
Product features:
High melting point (melting point: 227-309 ℃), good high-temperature strength;
Good fluidity;
Less slag output;
The solder joints are full and reliable.
This product is suitable for high-temperature tinning of self melting enameled wire for various transformer manufacturing.
Model: Lead free high-temperature solder bar
Melting point: 227~309 ℃
Packaging specification: 500g per piece (25kg per box)
instructions:
Suggest using our company's matching soldering flux for better performance.
After spraying flux on the welded parts, please preheat and dry them thoroughly.
Maintaining a full liquid level in the tin furnace can effectively reduce the generation of tin slag.
To prevent foreign objects from entering the tin solution, utensils that come into contact with the tin solution should avoid using materials such as zinc, aluminum, copper, etc.
Mixing different solder bars should be avoided.
The lead-free work environment should be completely isolated from the lead containing environment, avoiding the sharing of equipment to prevent pollution.
Product features:
Good fluidity;
The amount of slag produced is extremely small;
The solder joints are full, shiny, and reliable.
This product is suitable for lead-free wave soldering and hot-dip soldering processes in electronics, instruments, household appliances, printed circuit boards, etc. Cooperating with AIA's environmentally friendly soldering flux yields better results.
Product features:
Good fluidity;
The amount of slag produced is extremely small;
Full and reliable solder joints;
Excellent conductivity and thermal conductivity.
This product is suitable for lead-free wave soldering and hot-dip soldering of electronics, instruments, household appliances, and printed circuit boards (PCB). Specially suitable for special applications with high requirements for conductivity, thermal conductivity, and mechanical properties.