This product uses high-purity refined tin and silver as the main raw materials, combined with advanced melting technology, and specially added with a unique anti-oxidation alloy that has been developed for many years. This product complies with and exceeds the requirements of the EU RoHS directive.

Product features:

• Good fluidity;

• The amount of slag produced is extremely small;

• Full and reliable solder joints;

• Excellent conductivity and thermal conductivity.

This product is suitable for lead-free wave soldering and hot-dip soldering of electronics, instruments, household appliances, and printed circuit boards (PCBs). Specially suitable for special applications with high requirements for conductivity, thermal conductivity, and mechanical properties.

Model: SnAg0.3Cu0.7, SnAg3Cu0.5, SnAg3.5 (lead-free silver solder bar)

Packaging specification: 500g per piece (25kg per box)

Silver containing lead-free solder bar model

Instructions:

Suggested working temperature: 265-275 ℃, which can be adjusted appropriately depending on the welding condition and welding effect.

Suggest using our company's matching soldering flux for better performance.

After spraying flux on the welded parts, please preheat and dry them thoroughly.

Maintaining a full liquid level in the tin furnace can effectively reduce the generation of tin slag.

To prevent foreign objects from entering the tin solution, utensils that come into contact with the tin solution should avoid using materials such as zinc, aluminum, copper, etc.

Mixing different solder bars should be avoided.

The lead-free work environment should be completely isolated from the lead containing environment, avoiding the sharing of equipment to prevent pollution.