Active Solder Wire
Catalogue：Tin Lead Solder Wire
Product features:
The distribution of flux is uniform, with a deviation of ≤ 0.1%;
Good wettability and fast soldering speed;
Low smoke and minimal splashing;
The solder joints are bright, with minimal residue after welding, and high insulation resistance between solder joints.
This product is widely used for automatic and manual welding of electronics, instruments, household appliances, and printed boards.
Information
This product is mainly made of high-quality hydrogenated rosin and high-purity refined tin, using a composite multi-component active flux formula, combined with advanced production technology, strict quality control process, and complete testing system.
Product features:
The distribution of flux is uniform, with a deviation of ≤ 0.1%;
Good wettability and fast soldering speed;
Low smoke and minimal splashing;
The solder joints are bright, with minimal residue after welding, and high insulation resistance between solder joints.
This product is widely used for automatic and manual welding of electronics, instruments, household appliances, and printed boards.
Active solder wire model
| MODEL | ALLOY COMPOSITION | MELTING POINT |
| Sn63PbA | tin63%、lead37% | 183℃ |
| Sn60PbA | tin60%、lead40% | 183~190℃ |
| Sn55PbA | tin55%、lead45% | 183~203℃ |
| Sn50PbA | tin50%、lead50% | 183~215℃ |
| Sn45PbA | tin45%、lead55% | 183~221℃ |
| Sn40PbA | tin40%、lead60% | 183~238℃ |
| Sn35PbA | tin35%、lead65% | 183~248℃ |
| Sn30PbA | tin30%、lead70% | 183~258℃ |
| Sn25PbA | tin25%、lead75% | 183~267℃ |
| Sn20PbA | tin20%、lead80% | 183~279℃ |
Packaging specifications: 100g/roll (80 rolls/box), 500g/roll (40 rolls/box), 1kg/roll (10 rolls/box)
Wire diameter specification: 0.3-16mm
Flux content: 1.8% (conventional), 1.5% (low content), 2.5% (high content), solid core
The flux content can be customized according to demand
Suggested welding temperature: 300 ℃~350 ℃, which needs to be adjusted appropriately according to the size of the welded part, welding process, and welding effect.
Active solder wire flux type
Flux model | Expansion rate % | Purpose |
Y1 | ≥80 | Suitable for soldering high insulation resistance requirements in electronics, instruments, meters, household appliances, PCB boards, etc. |
Y2 | ≥85 | Suitable for welding difficult to weld metal base materials, such as galvanized, nickel plated, Kovar alloy, Dummy wire, beryllium bronze, etc., which require high efficiency for welding. |
Y3 | ≥90 | Suitable for welding difficult to weld metal base materials, such as capacitors, zinc spraying, gold spraying, nickel plating, zinc plating, Dummy wire, beryllium bronze and other welding with high efficiency requirements. |
S1 | ≥80 | Suitable for high insulation resistance spot welding, drag welding, secondary repair welding, etc. in electronics, instruments, meters, household appliances, PCB boards, etc. |
M1 | ≥75 | Suitable for high-precision and high reliability electronic products, the no cleaning soldering process ensures that the PCB board meets the SJ/T 11168 electronic industry standard without the need for cleaning after soldering. |
- Related products
Clean Free Solder Wire
Product features:
The distribution of flux is uniform, with a deviation of ≤ 0.1%;
Very little smoke and minimal splashing;
The solder joints are bright and there is very little residue after welding;
After welding, it can meet the SJ/T 11168 standard without the need for cleaning.
This product is suitable for the non cleaning welding process of high-precision and high reliability electronic products.
